Method for repairing and assembling contact image sensor module and structure thereof

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The invention claimed is:

1. A method for repairing and assembling contact image sensor (CIS) module, comprising following steps: (1) preparing a sensor housing having a first surface, a secondsurface, at least a securing post, and a plurality of receiving grooves being adapted to receive a plurality of optical elements; (2) preparing a PCB having photosensor elements, electronic elements and circuits thereon and being adapted to receive thelight signals produced by the said optical elements and convert said light signals into the electrical signals, said PCB further having at least a securing hole on a predetermined position thereof; (3) assembling the PCB into the sensor housing, thesecuring post of the sensor housing passing through the securing hole and extending through the PCB; (4) melting the tip of the securing post and forming a fastening means for fixing the PCB to the sensor housing; (5) testing the assembled CIS module,if the module can't pass the test, then doing the following steps: (6) cutting off the fastening means and taking away the PCB for repairing or replacing; (7) cutting off the securing post located on the sensor housing; (8) preparing a adapted posthaving a predetermined length of securing post and fixing said adapted post to a corresponding position of the sensor housing on which the original securing post located; (9) assembling the repaired or replaced PCB into the sensor housing, and make thetip of the adapted post passing through the securing hole and extending outwardly from the PCB; (10) melting the tip of the adapted post and forming a fastening means for fixing the repaired or replaced PCB to the sensor housing; (11) testing therepaired CIS module, if need, repeat the steps from step (6) to step (11) until the CIS passes the test.

2. The method for repairing and assembling contact image sensor module as claimed in claim 1, wherein the sensor housing has a plurality of molded securing posts therewith, each securing post having a securing base near the bottom to connect tothe sensor housing thereof, the outer diameter of said base being larger than the outer diameter of the tip of securing post.

3. The method for repairing and assembling contact image sensor module as claimed in claim 2, wherein the adapted post has a hollow portion, the inside diameter of said hollow portion being a little larger than the outside diameter of thesecuring base, so that said hollow portion of the adapted post can cover the securing base.

4. The method for repairing and assembling contact image sensor module as claimed in claim 3, wherein the inside surface of the hollow portion has at least a cavity thereon, with identified shape to making the sidewall uneven.

5. The method for repairing and assembling contact image sensor module as claimed in claim 4, wherein the adapted post is glued to the securing base, and the surplus glue being filled into the cavity of the hollow portion during the process ofgluing.

6. The method for repairing and assembling contact image sensor module as claimed in claim 1, wherein the optical element in the sensor housing at least include a rod lens and a LED light source.

7. The method for repairing and assembling contact image sensor module as claimed in claim 6, wherein LED light source comprises a LED and an optical rod.

8. A method for manufacturing an electrical device, comprising following steps: (1) preparing a housing of an electrical device having a portion made of thermoplastic material, said portion including at least a securing post made ofthermoplastic material; (2) preparing a circuit board having electronic elements and circuits thereon and being adapted to process the electrical signals, said circuit board further having at least a securing hole on a predetermined position thereof; (3) assembling said circuit board into the housing, the securing post of the housing passing through the securing hole and extending outwardly from the circuit board; (4) melting the tip of the securing post by the manner of hot-press and forming afastening means for fixing the circuit board to the housing; (5) testing the assembled electrical device, if the device can't pass the test, then doing the following steps: (6) cutting off the fastening means and taking away the circuit board forrepairing or replacing it; (7) cutting off the securing post located on the housing; (8) preparing a adapted post having a predetermined length of securing post and fixing the adapted post to a corresponding position of the housing on which the formersecuring post located; (9) assembling the repaired or replaced circuit board into the housing, and make the tip of the adapted post passing through the securing hole and extending outwardly from the circuit board; (10) melting the tip of the adaptedpost by the manner of hot-press and forming a fastening means for fixing the repaired or replaced circuit board to the housing; (11) testing the repaired electrical device, if need, repeat the steps from step (6) to step (11) until the device passes thetest.

9. The method for manufacturing a electrical device as claimed in claim 8, wherein the housing has a plurality of plastic-molded securing posts, each of said securing post having a securing base near the bottom thereof, and the base's outsidediameter being larger than the outer diameter of the tip of securing post.

10. The method for manufacturing a electrical device as claimed in claim 9, wherein the adapted post has a hollow portion, the inside diameter of said hollow portion being a little larger than the outside diameter of said securing base, so thatsaid hollow portion of the adapted post can cover the securing base.

11. The method for manufacturing an electrical device as claimed in claim 10, wherein the sidewall hollow portion has at least a cavity with identified shape to making the sidewall uneven.

12. The method for manufacturing an electrical device as claimed in claim 11, when the adapted post is glued to the securing base, the surplus glue being filled into said cavity of the hollow portion during the process of gluing.

13. An adapted post is used in the method for repairing and assembling the circuit board described by claim 1.

14. The method for repairing and assembling contact image sensor module as claimed in claim 5, wherein the optical element in the sensor housing at least include a rod lens and a LED light source.

15. An adapted post is used in the method for repairing and assembling the circuit board described by claim 8.